Rigid flex PCBs are an incredibly useful technology for a variety of applications. Flex-rigid printed circuit boards allow you to make custom boards that can flex and bend easily. The double-sided rigid flex PCBs allow for flexible circuits for more advanced applications, but unfortunately, these can be very difficult and expensive to manufacture. However, there is another way - using wirebondedCoB techniques that can be used to make extremely low-cost, flexible circuits.

Chip on Board (CoB) is one type of surface mounting technology that is often used along with wire-bonds to help your production to run at a much faster velocity than before. The characteristics of wirebonded Chip on Board make it a viable solution for rigid flex PCB applications that include high-quality, high frequency, and low inductance processes. Because wirebondedCoB on rigid flex PCB costs is highly economical nowadays, more companies are adopting it as it allows them to focus on profits rather than on production materials and process costs.

Process of WirebondingCoB on Rigid-Flex PCB

The wirebondingCoB on rigidflex PCB is quite different from that of a traditional PCB and involves several steps. The following sections discuss each step in detail:

1. Marking the Location of the Chip and Its Die Pad

The first thing you need to do is to mark the location of the chip and its die pad. This is done using a thermal transfer printer capable of printing onto a thermal transfer label. The thermal transfer labels are applied to both sides of the rigidflex PCB and cut out with an electric knife or another device. Once this is done, you can use a metal ruler to mark out where each chip needs to be located on your board and how far away from each other they need to be placed for them all to fit properly.

2. Cutting out the Die Pad Holes

The next step involves cutting out the die pad holes for each chip on your rigid flex PCB using an electric shear or another suitable tool such as a rotary punch machine or drill press. The die pad hole must be large enough to accommodate both your chip and its corresponding wire bonder wafer without any problems whatsoever so as not to cause any damage to your chips. This is important because if you do not use a proper die pad hole, the pressure exerted by the wire bonders during the bonding process may cause your chip to crack or break apart.

3. Soldering the Die Pads

The next step is to solder all of the die pads on your rigidflex PCB. The reason for doing this is that you want to make sure that all of your connections are strong and durable enough to withstand the rigors of operating under high temperatures and other extreme conditions. You will also want to ensure that they will not become loose over time, which could cause damage to your chips or even destroy them completely.

4. Bonding Pads and Wirebonding

The next step is to bond your die pads to the wirebonds. You can do this by using your temperature-controlled hot plate and a small amount of solder paste. You will place your PCB on top of the hot plate, turn it on, and allow a small amount of solder paste which is sticky, to flow over all of the die pads on our board. The reason for doing this is so that when you go to bond your chips, they will stick to the solder and not fall off.

5. Soldering Chips onto PCB

The final step is to put your chips into place on top of all the die pads that have been bonded together with solder paste. You will want to ensure they are aligned correctly with each other beforehand so that they fit properly into their respective holes in your board. Then place them down onto the pads and use some more solder paste along with your soldering iron or hot air rework station to secure them in place firmly.

Also see : How to Reduce Rigid Flex PCB Costs

Benefits of WirebondedCoB on Rigid-Flex PCB

The main reason why many companies are choosing to switch over from rigid PCBs to wirebondedCoB is that they offer a wide range of benefits that can help you improve your circuit design and functionality.

  • By incorporating a wirebonded chip onto your rigid flex circuit board, you can take advantage of the enhanced electrical performance of this design feature. It provides higher current carrying capacity, improved signal integrity, and lower impedance than traditional rigid flex designs without chips. And since there is no need for high-temperature conversions or additional bonding steps, wirebonded chips can save time during manufacturing processes.
  • The wires connecting the chip terminals to the pad allow for a direct connection between the chip and the pad, so there is no chance of cold welding or poor electrical contact with solder bumps or other types of interconnects.
  • CoB PCBs are extremely durable, flexible, and lightweight. This makes them great for applications where there is a need to make the PCB light enough to move around easily but sturdy enough to last in harsh environments. CoB technology is ideal for complex applications such as smartphones, tablets, or other electronic devices where space is limited.
  • In addition to improved thermal performance, CoB technology also reduces component count by eliminating the need for discrete components such as connectors and pigtails since all electrical connections are made directly through solder balls or wires located directly on top of each chip rather than a connector.

Conclusion

Wirebonded components are used in a variety of situations, but properly designed and manufactured CoB can be used to improve existing circuit boards. CoB on rigid flex PCB is still a relatively new technology but can prove to be useful and cost-effective in certain situations. Using wirebonded components in CoB requires more design considerations than some other wirebond applications. If you attempt to design any PCBs with a high density, then you should consider designing them with Wirebonded Chip on Board (CoB).

We hope that this post was helpful to people out there looking to do rigid flex CoB PCBs. If you could get something from this information, we suggest you check out Hemeixin’s guide to different PCB types and materials used in PCB.

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